Renesas Stereo Amplifier HA31005ANP User Guide

HA31005ANP  
SiGe MMIC  
High Frequency Power Amplifier  
REJ03F0173-0200  
Rev.2.00  
Jul 31, 2007  
Features  
Ideal for IEEE802.11a / b / g / n applications. e.g. Wireless LAN FEM  
High Gain (24 dB @ 5.2 GHz, 30dB @ 2.4 GHz)  
Small footprint package.  
(HWQFN-16 : 3.0 x 3.0 x 0.8 mm)  
RoHS Compliant  
Outline  
RENESAS Package code: PWQN0016KA-B  
(Package name: HWQFN-16)  
1. GND  
2. RFout  
3. RFout  
4. GND  
5. GND  
6. VB3  
7. VB2  
8. VB1  
9. VCC  
10. GND  
11. RFin  
12. GND  
13. VC1  
14. GND  
15. VC2  
16. GND  
17  
9
4
10  
3
5
8
11  
2
1
12  
6
7
7
9
6
8
5
31005  
16  
15  
14  
13  
13  
14  
15  
16  
4
10  
3
11  
2
12  
1
17. GND  
Absolute Maximum Ratings  
(Ta = 25°C)  
Item  
Supply Voltage  
Symbol  
VCC  
Ratings  
Unit  
V
4
400  
Maximum Current  
ICC  
mA  
dBm  
W
Maximum Input Power  
Total Power Dissipation  
Operating Case Temperature  
Storage Temperature  
Pin max  
Pt  
+10  
1.4note  
Tc(op)  
Tstg  
-10 to +85  
–55 to +150  
°C  
°C  
Notes: Value on PCB (FR-4 : 20 x 20 x 0.4 mm double side)  
REJ03F0173-0200 Rev.2.00 Jul 31, 2007  
Page 1 of 7  
 
HA31005ANP  
Evaluation Circuit for IEEE 802.11a  
V
= 3.0 V  
bb  
*
1.5  
k  
1.5 k  
1.5 kΩ  
*
*
*
5
8
4
9
2 pF  
RFout  
1 pF  
RFin  
0.5 pF  
0.5 pF  
12  
1
0.2 pF  
16  
13  
1 pF  
*
*
*
*
*
* 1000 pF  
V
cc  
= 3.3 V  
REJ03F0173-0200 Rev.2.00 Jul 31, 2007  
Page 3 of 7  
 
HA31005ANP  
Characteristics for IEEE 802.11a  
f = 5.15 GHz  
64 QAM / OFDM, Encode rate ¾, 54 Mbps, idle interval = 110 µs, 1024 + 34 byte / frame  
EVM vs. Pout  
Power Gain vs. Output Power  
30  
25  
20  
15  
10  
5
12  
10  
8
Vcc = 3.3 V  
Vbb = 3.0 V  
6
4
2
Vcc = 3.3 V  
Vbb = 3.0 V  
0
0
0
4
8
12  
16  
20  
24  
0
4
8
12  
16  
20  
24  
Output Power Pout (dB)  
Output Power Pout (dBm)  
Circuit Current vs. Output Power  
Output Power vs. Input Power  
24  
20  
16  
12  
8
400  
350  
300  
250  
200  
150  
100  
50  
Vcc = 3.3 V  
Vbb = 3.0 V  
4
Vcc = 3.3 V  
Vbb = 3.0 V  
0
0
-24  
-20  
-16  
-12  
-8  
-4  
0
0
4
8
12  
16  
20  
24  
Output Power Pout (dB)  
Input Power Pin (dBm)  
REJ03F0173-0200 Rev.2.00 Jul 31, 2007  
Page 4 of 7  
 
HA31005ANP  
Evaluation Circuit for IEEE 802.11g  
V
= 3.3 V  
bb  
*
*
2.4  
k  
2.4 k  
2.0 kΩ  
5
8
4
9
RFout  
33 pF  
RFin  
22 pF  
1 pF  
12  
1
1 pF  
8.2 nH  
16  
13  
*
*
*
*
*
*
* 1000pF  
V
cc  
= 3.3 V  
REJ03F0173-0200 Rev.2.00 Jul 31, 2007  
Page 5 of 7  
 
HA31005ANP  
Characteristics for IEEE 802.11g  
f = 2.484 GHz  
64 QAM / OFDM, Encode rate ¾, 54 Mbps, idle interval = 110 µs, 1024 + 34 byte / frame  
EVM vs. Pout  
Power Gain vs. Output Power  
36  
30  
24  
18  
12  
6
12  
10  
8
Vcc = 3.3 V  
Vbb = 3.3 V  
6
4
2
Vcc = 3.3 V  
Vbb = 3.3 V  
0
0
0
4
8
12  
16  
20  
24  
0
4
8
12  
16  
20  
24  
Output Power Pout (dB)  
Output Power Pout (dBm)  
Circuit Current vs. Output Power  
Output Power vs. Input Power  
24  
20  
16  
12  
8
400  
350  
300  
250  
200  
150  
100  
50  
Vcc = 3.3 V  
Vbb = 3.3 V  
4
Vcc = 3.3 V  
Vbb = 3.3 V  
0
-4  
0
-32 -28 -24 -20 -16 -12 -8  
-4  
0
4
8
12  
16  
20  
24  
Output Power Pout (dB)  
Input Power Pin (dBm)  
REJ03F0173-0200 Rev.2.00 Jul 31, 2007  
Page 6 of 7  
 
HA31005ANP  
Package Dimensions  
Package Name  
HWQFN-16  
JEITA Package Code  
P-HWQFN16-3x3-0.50  
RENESAS Code  
PWQN0016KA-B  
Previous Code  
MASS[Typ.]  
0.020g  
1.50  
L
p
D
B
A
C0.3  
Dimension in Millimeters  
0.05  
B
Reference  
Symbol  
ZD  
Min  
2.90  
2.90  
0.70  
0
Nom  
3.00  
3.00  
0.75  
Max  
3.10  
3.10  
0.80  
0.05  
b
x
M
S
A
D
E
y1  
S
A
A1  
A2  
b
0.23  
0.50  
0.35  
e
Lp  
x
y
S
S
0.10  
0.08  
0.10  
y
y1  
ZD  
ZE  
0.75  
0.75  
Marking  
Type number  
31005  
Assembly lot indication  
Direction index  
Ordering Information  
Part No.  
Quantity  
Shipping Container  
φ178 mm reel, 12 mm emboss taping  
HA31005ANPTL-E  
2000 pcs.  
REJ03F0173-0200 Rev.2.00 Jul 31, 2007  
Page 7 of 7  
 
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Notes:  
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes  
warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property  
rights or any other rights of Renesas or any third party with respect to the information in this document.  
2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including,  
but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples.  
3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass  
destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws  
and regulations, and procedures required by such laws and regulations.  
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this  
document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document,  
please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be  
5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a  
result of errors or omissions in the information included in this document.  
6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability  
of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular  
application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products.  
7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications  
or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality  
and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or  
undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall  
have no liability for damages arising out of the uses set forth above.  
8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:  
(1) artificial life support devices or systems  
(2) surgical implantations  
(3) healthcare intervention (e.g., excision, administration of medication, etc.)  
(4) any other purposes that pose a direct threat to human life  
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing  
applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all  
damages arising out of such applications.  
9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range,  
movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages  
arising out of the use of Renesas products beyond such specified ranges.  
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain  
rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage  
caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and  
malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software  
alone is very difficult, please evaluate the safety of the final products or system manufactured by you.  
11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as  
swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products.  
Renesas shall have no liability for damages arising out of such detachment.  
12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas.  
13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have  
any other inquiries.  
RENESAS SALES OFFICES  
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.  
Renesas Technology America, Inc.  
450 Holger Way, San Jose, CA 95134-1368, U.S.A  
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501  
Renesas Technology Europe Limited  
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.  
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900  
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Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120  
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898  
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Tel: <852> 2265-6688, Fax: <852> 2730-6071  
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Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999  
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Tel: <65> 6213-0200, Fax: <65> 6278-8001  
Renesas Technology Korea Co., Ltd.  
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Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145  
Renesas Technology Malaysia Sdn. Bhd  
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia  
Tel: <603> 7955-9390, Fax: <603> 7955-9510  
© 2007. Renesas Technology Corp., All rights reserved. Printed in Japan.  
Colophon .7.0  
 

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