HD74HC1G66
Analog Switch
REJ03D0188–0800Z
(Previous ADE-205-314F (Z))
Rev.8.00
Jan.27.2004
Description
The HD74HC1G66 is high-speed CMOS analog switch using silicon gate CMOS process. With CMOS
low power dissipation, it provides high speed. The device has low ON resistance for good transfer
characteristics and can take wide range of input voltage.
Features
•
•
•
The basic gate function is lined up as Renesas uni logic series.
Supplied on emboss taping for high-speed automatic mounting.
Electrical characteristics equivalent to the HD74HC4066
Supply voltage range : 2 to 6 V
Operating temperature range : –40 to +85°C
•
Ordering Information
Part Name
Package Type
Package Code
Package
Abbreviation
Taping Abbreviation
(Quantity)
HD74HC1G66CME CMPAK-5 pin
CMPAK-5A
CM
E (3,000 pcs/reel)
Rev.8.00, Jan.27.2004, page 1 of 8
HD74HC1G66
Absolute Maximum Ratings
Item
Symbol
Ratings
–0.5 to 7.0
–0.5 to VCC + 0.5
–0.5 to VCC + 0.5
±20
Unit
V
Test Conditions
Supply voltage range
Input voltage range *1
Output voltage range *1, 2
Input clamp current
Output clamp current
Continuous output current
VCC
VI
V
VO
IIK
V
Output : H or L
VI < 0 or VI > VCC
VO < 0 or VO >VCC
VO = 0 to VCC
mA
mA
mA
mA
IOK
IO
CC or IGND
±20
±25
Continuous current through
VCC or GND
I
±25
Maximum power dissipation
at Ta = 25°C (in still air) *3
PT
200
mW
Storage temperature
Tstg
–65 to 150
°C
Notes:
The absolute maximum ratings are values, which must not individually be exceeded, and
furthermore, no two of which may be realized at the same time.
1. The input and output voltage ratings may be exceeded if the input and output clamp-current
ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The maximum package power dissipation was calculated using a junction temperature of 150°C.
Recommended Operating Conditions
Item
Symbol
VCC
Min
2
Max
6
Unit
V
Test Conditions
Supply voltage range
Input voltage range
Output voltage range
VI/O
0
VCC
VCC
1000
500
400
85
V
VO
0
V
Input rise / fall time
(Control input 10% to 90%)
tr, tf
0
ns
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
0
0
Operating temperature
Ta
–40
°C
Note: Unused or floating control inputs must be held high or low.
Rev.8.00, Jan.27.2004, page 3 of 8
HD74HC1G66
Electrical Characteristics
VCC
Ta = 25°C
Ta = –40 to 85°C
Item
Symbo (V)
Unit Test Conditions
Min
1.5
3.15
4.2
—
Typ
Max
—
Min
1.5
3.15
4.2
—
Max
—
Input voltage
VIH
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
6.0
—
V
Control input only
—
—
—
—
—
—
VIL
—
0.5
0.5
—
—
1.35
1.8
—
1.35
1.8
—
—
—
On resistance
RON
—
200
90
450
160
130
1500
200
170
±0.1
—
550
180
140
2000
250
210
±1.0
Ω
VC = VIH
VIN = VCC or GND
IT = 1 mA
—
—
—
80
—
Peak on
resistance
RON (p)
IS (off)
—
600
125
100
—
—
Ω
VC = VIH
VIN = 0 to VCC
IIN/OUT = 1 mA
—
—
—
—
Leak current
—
—
µA
VC = VIL
VIN = VCC, VOUT = GND
or VIN = GND,
VOUT = VCC
IS (on)
6.0
—
—
±0.1
—
±1.0
µA
VC = VIH
VIN = VCC or GND
Input current
IIN
6.0
6.0
—
—
—
—
±0.1
1.0
—
—
±1.0
10.0
µA
VIN = VCC or GND
VIN = VCC or GND
Operating
current
ICC
µA
Rev.8.00, Jan.27.2004, page 4 of 8
HD74HC1G66
Switching Characteristics
VCC
Symbol (V)
Ta = 25°C
Ta = –40 to 85°C
Item
Unit
Test Conditions
Min
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ Max Min Max
Propagation delay time tPLH
,
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
—
4
50
10
9
—
—
—
—
—
—
—
—
—
—
—
—
—
65
13
11
145
29
25
145
29
25
—
ns
RL = 10 kΩ
tPHL
—
—
10
—
—
14
—
20
30
30
2.5
Output enable time
Output disable time
tZH, tZL
115
23
20
115
23
20
—
—
—
5
ns
RL = 1 kΩ
tHZ, tLZ
ns
RL = 1 kΩ
Maximum control
frequency
MHz
pF
—
—
Control input
capacitance
CIN
5
Switch I/O capacitance CIN/OUT
—
—
2.5
0.5
—
—
—
—
—
—
pF
pF
Feed through
capacitance
CIN–OUT
Power dissipation
capacitance
CPD
—
5
—
—
—
pF
(CL = 50 pF, tr = tf = 6 ns)
Rev.8.00, Jan.27.2004, page 5 of 8
HD74HC1G66
Test Circuit
• R
ON
VCC
VC = VIH
VCC
(ON)
GND
VIN-OUT
10–3
VIN = VCC
VOUT
RON
=
(Ω)
1.0 mA
+
–
V
V
IN-OUT
• I (off), I (on)
S
S
VCC
VCC
VC = VIL
VC = VIL
VCC
(OFF)
GND
VCC
(ON)
GND
A
A
VOUT = GND
or VCC
VOUT
OPEN
VIN = VCC
or GND
VIN = VCC
or GND
•
t
, t
PLH PHL
VCC
tr = 6 ns
tf = 6 ns
VC = VIH
VCC
90% 90%
50% 50%
tPLH
VIN
10%
VCC
(ON)
GND
10%
tPHL
GND
VOH
VIN
VOUT
RL =
10 kΩ
CL =
VOUT
50 pF
50%
50%
VOL
Rev.8.00, Jan.27.2004, page 6 of 8
HD74HC1G66
•
t
, t / t , t
ZH ZL HZ LZ
VCC
tr = 6 ns
tf = 6 ns
VC
RL =
VCC
GND
VOH
1 kΩ
90% 90%
50% 50%
VC
VCC
VIN
VOUT
CL =
10%
10%
tHZ
S1
S2
tZH
GND
RL =
1 kΩ
50 pF
90%
50%
50%
Waveform - A
VOUT
GND
VCC
Item
tZH
tZL
S1
S2
tZL
tLZ
VCC
GND
VCC
Waveform - B
GND
VCC
10%
VOL
tHZ
tLZ
GND
VCC
GND
Notes: 1. Waveform - A is for an output with internal conditions such that the output is high
except when disabled by the output control.
2. Waveform - B is for an output with internal conditions such that the output is low
except when disabled by the output control.
• Maximum control frequency
VCC
VC
VCC
GND
VC
VCC
VOUT
VIN = VCC
RL =
CL =
GND
1 kΩ
15 pF
VOUT
VCC/2
• C
, C
IN/OUT IN-OUT
CIN-OUT
VCC
VC = GND
VCC
(OFF)
GND
CIN/OUT
CIN/OUT
Rev.8.00, Jan.27.2004, page 7 of 8
HD74HC1G66
Package Dimensions
Unit: mm
1.3 ± 0.2
+ 0.1
– 0.05
(0.65)
(0.65)
0.15
0 – 0.1
5 – 0.2 ± 0.05
2.0 ± 0.2
Package Code
JEDEC
CMPAK–5V
—
JEITA
Mass (reference value)
Conforms
0.006 g
Rev.8.00, Jan.27.2004, page 8 of 8
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501
Renesas Technology Europe Limited.
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom
Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900
Renesas Technology Europe GmbH
Dornacher Str. 3, D-85622 Feldkirchen, Germany
Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11
Renesas Technology Hong Kong Ltd.
7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2375-6836
Renesas Technology Taiwan Co., Ltd.
FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology (Shanghai) Co., Ltd.
26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952
Renesas Technology Singapore Pte. Ltd.
1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
© 2004. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .1.0
|