Fujitsu Switch MB3842 User Manual

FUJITSU SEMICONDUCTOR  
DATA SHEET  
DS04-27604-2E  
ASSP For Power Supply Applications  
Power Management 2-ch Switch IC  
MB3842/MB3845  
DESCRIPTION  
The MB3842/3845 is a power management switch with built-in 2-channel low-on resistance (typ. 100m) switch.  
Output control is by means of a control signal, and the MB3842 is designed for high-active operation (output on  
when EN is Hi), while the MB3845 is designed for low-active operation (output on when EN is low.)  
To provide adaptability to a variety of operations, the MB3842/3845 features low input voltage (VIN > 2.5V)  
operation and stable low-on resistance independent of input voltage. The switching current limit can be set from  
100mA to 600mA by using external resistance, and when overcurrent conditions are detected the OC output goes  
low to provide an external notification signal.  
VIN is divided between the two channels, which operate independently of each other.  
In addition, an off-state reverse current prevention function is provided to ensure accurate on/off switching action.  
FEATURES  
• Low on resistance switch (typ. 100m)  
• Low input voltage operation (2.5 V to 5.5 V)  
• Switch current (max. 0.6 A)  
• UVLO  
• ENABLE  
:VIN threshold  
:EN threshold  
2.3V/2.1 V hysteresis 200 mV  
EN 1.4V/1.6 V for MB3842, EN 1/2 VIN for MB3845  
:Power supply current at output off = 0µA EN < 0.8V for MB3842, EN = VIN for MB3845  
• External setting for soft start time and switch current limit.  
• Over-temperature detection (switch latched off), over-current detection (not latched)  
• OC pin flag set following overcurrent detection, over-temperature detection, or UVLO detection.  
• Reverse current prevention at OFF (VIN 1.5 V)  
• Either channel may be operated alone.  
PACKAGE  
20-pin plastic SSOP  
(FPT-20P-M03)  
 
MB3842/MB3845  
PIN DESCRIPTION  
Pin no.  
Symbol  
Descriptions  
Control signal input pin.  
EN  
(MB3842)  
Set “H” to turn switch on, “L” to turn toff. At 0.8 V or less, the chip is in STBY state  
and current consumption is less than 1µA.  
“L” level is 1.4V (typ), “H” level is 1.6V (typ), with 200mV (typ) hysteresis.  
Control signal input pin.  
Set “L” to turn switch on, “H” to turn off.  
1/10  
EN  
(MB3845)  
At “H” level = VIN, the chip is in STBY state and current consumption is less than  
1µA.  
Normally used as CMOS inverter input, so that recommended use is “L” level at  
GND +0.5V or less, and “H” level is VIN -0.5V or greater.  
Slow start setting pin. Used to adjust the switch on/off timing.  
Add external capacitance to delay operation. Leave open when not in use.  
In open mode voltages up to 12 V are present. Care should be taken in mounting  
to prevent leakage current generation because high impedance is required.  
2/9  
3/8  
SS  
CS  
Current limit setting pin.  
The limit current level is set by connecting this pin to external resistance.  
Switch output pin.  
An UVLO (VIN power monitor function) is provided so that when VIN reaches 2.3V  
(typ.) or higher the OC pin voltage goes to “H” level. Also if the VIN voltage drops to  
2.1 V (typ.) or lower the OC output goes to “L” state.  
200mV (typ) hysteresis is provided.  
4/5/6/7  
11/20  
VIN  
GND  
Ground pin.  
External notification pin.  
When the switch is in on mode this pin normally outputs a “H” level signal, but  
changes to “L” level when an overcurrent, overtemperature, or UVLO condition is  
detected.  
12/19  
OC  
This is an open drain connection, and should be pulled up to high potential using  
resistance.  
13/14/15  
16/17/18  
OUT  
Switching output pin.(N-ch MOSFET source)  
3
 
MB3842/MB3845  
BLOCK DIAGRAM (for 1 channel)  
MB3842  
OUT1  
CS1  
Over current  
detection 1  
Charge  
pump1  
+
COMP  
SS1  
EN1  
Q
S
R
FF1  
+
COMP  
OSC1  
OC1  
VIN1  
BGR1  
Temperature  
protection 1  
MB3845  
OUT1  
CS1  
Charge  
pump1  
Over current  
detection 1  
+
COMP  
SS1  
Q
S
R
FF1  
EN1  
+
COMP  
OSC1  
OC1  
VIN1  
BGR1  
Temperature  
protection 1  
4
 
MB3842/MB3845  
ABSOLUTE MAXIMUM RATINGS  
Rating  
Unit  
Parameter  
Input voltage  
Symbol  
Condition  
Max.  
–0.3  
–0.3  
Min.  
VIN  
VEN  
ISW  
7.0  
V
V
ENABLE voltage  
Switch current  
7.0  
1.8  
A
Power dissipation  
Storage temperature  
PD  
Ta = +85°C  
216  
+125  
mW  
°C  
TSTG  
–55  
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,  
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.  
RECOMMENDED OPERATING CONDITIONS  
Value  
Parameter  
Symbol  
Condition  
Unit  
Min.  
2.5  
0
Typ.  
5.0  
Max.  
5.5  
5.5  
0.6  
10  
Input voltage  
VIN  
VEN  
ISW  
V
V
ENABLE voltage  
Switch current  
VEN VIN  
VIN = 2.5 V to 5.5 V  
A
SS pin capacitance  
OC sink current  
CSS*  
IOCS  
nF  
mA  
kΩ  
kΩ  
VIN = 5.0 V, VOC = 0.4 V  
VIN = 5.0 V (ISW = 0.6 A)  
VIN = 5.0 V (ISW = 0.1 A)  
2.0  
1.4  
3.6  
5.0  
2.0  
6.2  
2.6  
9.1  
Current limit  
resistance  
RLIM*  
TOP  
Operating  
temperature  
–20  
+85  
°C  
* : For CSS, RLIM settings, see “TYPICAL CHARACTERISTICS” and “FUNCTIONAL DESCRIPTION”.  
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the  
semiconductor device. All of the device's electrical characteristics are warranted when the device is  
operated within these ranges.  
Always use semiconductor devices within their recommended operating condition ranges. Operation  
outside these ranges may adversely affect reliability and could result in device failure.  
No warranty is made with respect to uses, operating conditions, or combinations not represented on  
the data sheet. Users considering application outside the listed conditions are advised to contact their  
FUJITSU representatives beforehand.  
5
 
MB3842/MB3845  
ELECTRICAL CHARACTERISTICS (per 1 ch)  
• MB3842/MB3845  
(VIN = 5 V, Ta = +25°C)  
Value  
Parameter  
Symbol  
Condition  
Unit  
Min.  
Typ.  
100  
350  
1.0  
Max.  
150  
550  
1.5  
Switch resistance  
RON  
IIN1  
ISW =0.6A  
ISW = 0 A  
ISW = 0.6 A  
mΩ  
µA  
IIN2  
mA  
IN pin input current  
EN < 0.8V for MB3842,  
EN = VIN for MB3845  
IIN3  
1.0  
µA  
VIUH  
VIUL  
VIUHY  
ISWH  
ISWL  
IOCS  
IOCL  
VIN at OC = L H  
VIN at OC = H L  
VIUHY = VIUH – VIUL  
RLIM = 2.0 kΩ  
2.1  
1.9  
2.3  
2.1  
200  
0.6  
0.1  
5.0  
2.5  
2.3  
300  
0.78  
0.14  
V
V
UVLO threshold  
UVLO hysteresis width  
Switch current limit  
100  
0.42  
0.06  
2.0  
mV  
A
RLIM = 6.2 kΩ  
A
VOC = 0.4 V at OC active  
VOC = 5.0 V at OC non-active  
mA  
µA  
°C  
OC sink current  
1.0  
Temperature protection (Tj)  
OUT pin rise time  
TLIM  
+125  
SS pin: Open  
OUT pin: 100 kpull down  
tON  
100  
50  
200  
120  
µs  
µs  
SS pin: Open  
OUT pin: 100 kpull down  
OUT pin fall time  
tOFF  
• MB3842  
(VIN = 5 V, Ta = +25°C)  
Value  
Parameter  
Symbol  
Condition  
Unit  
Min.  
Typ.  
5
Max.  
10  
IENH  
IENL  
VEN = 5 V, ISW = 0 A  
µA  
µA  
V
ENABLE pin input current  
VEN = 0 V, ISW = 0 A  
0.0  
VTHEN  
VTLEN  
VENHY  
1.45  
1.25  
100  
1.60  
1.40  
200  
1.75  
1.55  
300  
ENABLE pin threshold  
voltage  
V
ENABLE hysteresis width  
VENHY = VTHEN – VTLEN  
mV  
• MB3845  
(VIN = 5 V, Ta = +25°C)  
Value  
Parameter  
Symbol  
Condition  
Unit  
Min.  
Typ.  
0.0  
0.0  
Max.  
IENH  
IENL  
VEN = 5 V, ISW = 0 A  
µA  
µA  
V
ENABLE pin input current  
ENABLE pin input voltage  
VEN = 0 V, ISW = 0 A  
VILEN  
VIHEN  
0
0.8  
5.0  
3.0  
V
6
 
MB3842/MB3845  
DIAGRAM  
• Normal operation  
5 V  
VIN  
Hi  
EN  
EN  
Low  
SW OFF  
SW ON  
SW ON  
5 V  
VOUT  
Overcurrent does not occur  
IOUT  
OC  
5 V  
5 V  
• At VIN fall  
2.3 V  
VIN  
2.1 V  
Hi  
EN  
EN  
Low  
SW ON  
SW ON  
SW ON  
5 V  
VOUT  
Overcurrent does not occur  
IOUT  
OC  
5 V  
= 0 V  
Note: The OC pin should be pulled up using a separate power supply and resistance.  
(This illustration shows pull-up with a separate 5V source.)  
(Continued)  
7
 
MB3842/MB3845  
(Continued)  
• At overcurrent detection  
5 V  
VIN  
Hi  
EN  
EN  
Low  
SW ON  
OFF  
ON  
OFF  
5 V  
VOUT  
IOUT  
OC  
5 V  
= 0 V  
5 V  
• At over-temperature occurrence  
Over-temperature  
VIN  
Over-temperature corrected  
occurs  
Hi  
EN  
EN  
Low  
5 V  
SW ON  
SW OFF  
VOUT  
Overcurrent does not  
occur  
IOUT  
OC  
5 V  
= 0 V  
Latch released  
Latch set  
Note: The OC pin should be pulled up using a separate power supply and resistance.  
(This illustration shows pull-up with a separate 5V source.)  
8
 
MB3842/MB3845  
TYPICAL CHARACTERISTICS  
• RLIM vs. limit current characteristics  
ThesearethelimitingvaluecharacteristicsforCSpin-to-GND  
external resistance and output current (OC flag).  
10  
1
VIN = 5.0 V  
VIN = 3.3 V  
VIN = 2.5 V  
0.1  
0.01  
100  
1000  
10000  
100000  
RLIM ()  
• CSS vs. TON (SS) characteristics  
There are the characteristics for SS pin-to-GND external  
capacitance and output ON time.  
100  
10  
VIN = 5.0 V  
VIN = 3.3 V  
VIN = 2.5 V  
1
0.1  
10  
100  
1000  
10000  
100000  
CSS (pF)  
(Continued)  
9
 
MB3842/MB3845  
(Continued)  
• SW resistance vs. temperature characteristics  
150  
140  
130  
120  
110  
100  
90  
at 0.1 A  
at 0.6 A  
at 1 A  
80  
70  
60  
50  
60  
40  
20  
0
20  
40  
60  
80  
100  
120  
Temperature Ta (°C)  
• Temperature-dependedSWresistancevs. VIN (V)characteristics  
150  
140  
130  
120  
110  
100  
90  
40 °C  
25 °C  
100 °C  
80  
70  
60  
50  
2
3
4
5
6
7
VIN voltage (V)  
(Continued)  
10  
 
MB3842/MB3845  
(Continued)  
• Output power (ISW) saturation characteristics  
5 V  
Measurement circuit  
VIN  
EN, EN OC  
SS  
VIL/VIH  
ISW  
“Open”  
A
OUT  
GND  
CS  
2 Ω  
100 kΩ  
RLIM  
VSW  
5 V  
These are the output saturation current characteristics in  
overcurrent state.(when not controlled by the OC pin warning flag)  
1600  
1400  
1200  
1000  
800  
600  
400  
200  
0
RLIM not limited (CS GND)  
RLIM set to 2.0k, 0.6A  
Unlimited  
6.2 k (0.1 A)  
2 k (0.6 A)  
Overcurrent flag set  
(when set for 0.6A)  
Temperature protection  
range  
RLIM set to 6.2k, 0.1A  
Overcurrent flag set  
(when set for 0.1A)  
0
1
2
3
4
5
6
VSW (V)  
(Continued)  
11  
 
MB3842/MB3845  
(Continued)  
• OC pin flag pull-up resistance (pull-up power 5V) dependant overcurrent operation  
1 V / 500 NS  
50 kΩ  
1 V / 500 NS  
1 kΩ  
GND  
1 V / 500 NS  
10 kΩ  
1 V / 500 NS  
100 kΩ  
• Power derating characteristics  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
20  
0
20  
40  
60  
80  
100  
Temperature Ta (°C)  
12  
 
MB3842/MB3845  
FUNCTIONAL DESCRIPTION  
Current Limit Setting  
By placing resistance between the CS and GND pins, the current limit can be set between 100mA and 600mA  
within ±30% accuracy (VIN = 5 V, current limit at 600mA). Because the setting value is dependent on VIN voltage,  
the user should select the optimum resistance value for the value of VIN voltage . When the switching current  
exceeds the set value, the OC pin goes to “L” level as an external notification signal, but there is no latching  
function. To hold operation on “off” state, the input signal to the EN and EN pins should be used.  
When a direct connection to GND is used, there is no current limitation.  
When the connection is open, the switch is in a state of continuously held current limits.  
Thermal Shutdown  
The MB3842/MB3845 has a thermal shutdown function which turns the switch off and sets the latch to protect  
the device when junction temperature exceeds 125°C.  
At the same time the OC output signal goes to “L” level to notify external systems.  
The latch function can be reset by sending a low signal to the EN input of the MB3842, or a high signal to the  
EN input of the MB3845.  
Slow Start  
The on/off switching time can be delayed by applying capacitance between the SS and GND pins. Controlling  
the on time can soften surge current to the load side capacitance when power is turned on.  
For details, see “Css vs. tON (SS) characteristics” on p. 9.  
UVLO  
A VIN voltage monitoring function is provided, so that when VIN voltage exceeds 2.3 V (typ) the OC pin voltage  
goes to “H” level. When VIN voltage falls below 2.1V (typ), the OC output goes to “L” state.  
Error Flag OC Pin  
The OC pin produces a “L” signal in case of a UVLO, overcurrent, or over-temperature condition. In case of  
overcurrent, the output has a pulse waveform. See P12.  
(note) Output current limit setting resistance values are shown on P9, and in the following table. (CS pin-to-GND)  
Standard Values  
VIN/ISW  
VIN 5.0V  
VIN 3.3V  
VIN 2.5V  
0.1 A  
0.2 A  
0.3 A  
0.4 A  
0.5 A  
0.6 A  
0.7 A  
0.8 A  
0.9 A  
1.0 A  
6.2 k4.3 k3.3 k2.7 k2.2 k2.0 k1.8 k1.6 k1.4 k1.3 kΩ  
9.1 k5.6 k4.3 k3.3 k2.7 k2.4 k2.0 k1.8 k1.6 k1.5 kΩ  
13 kΩ  
7.5 k5.1 k3.9 k3.0 k2.7 k2.2 k2.0 k1.8 k1.6 kΩ  
13  
 
MB3842/MB3845  
TYPICAL APPLICATION  
Top View  
MB3842/MB3845  
EN1  
EN1  
GND  
OC1  
Control signal  
Pull-up resistance  
CSS  
SS1  
RLIM  
OUT1  
OUT1  
OUT1  
CS1  
VIN1  
VIN1  
Load  
VIN2  
VIN2  
OUT2  
OUT2  
OUT2  
OC2  
Load  
RLIM  
CS2  
SS2  
Pull-up resistance  
CSS  
EN2  
EN2  
GND  
Control signal  
14  
 
MB3842/MB3845  
APPLICATION EXAMPLE  
(1) Dual-Port Self-Powered Hub Application (NON-GANG Mode Connection)  
USB 5 V Controller  
Overcurrent  
MB3842/MB3845  
ON/OFF  
GND  
EN1,EN1  
SS1  
OC1  
OUT1  
CS1  
VIN1  
VIN1  
OUT1  
OUT1  
USB  
Port 1  
Power Supply  
5 V  
OUT2  
OUT2  
OUT2  
OC2  
VIN2  
USB  
Port 2  
VIN2  
CS2  
SS2  
GND  
EN2,EN2  
*The MB3842 can also be adapted for use with 3.3V controllers.  
USB Port 500mA MAX Par Port  
Smoothing capacitors should be placed between VIN and GND, or between OUT and GND as required.  
15  
 
MB3842/MB3845  
(2) Dual-Port Bus Powered Hub Application (GANG Mode Connection)  
USB  
Overcurrent  
MB3842/MB3845  
ON/OFF  
GND  
EN1,EN1  
OC1  
SS1  
USB Port1(×4)  
OUT1  
OUT1  
OUT1  
OUT2  
OUT2  
OUT2  
OC2  
CS1  
VIN1  
VIN1  
VIN2  
VIN2  
CS2  
400 mA MAX  
(100 mA ×4)  
5 V  
Upstream Port  
USB Port2(×4)  
400 mA MAX  
(100 mA ×4)  
SS2  
EN2,EN2  
GND  
USB Port 100mA MAX Par Port  
Smoothing capacitors should be placed between VIN and GND, or between OUT and GND as required.  
16  
 
MB3842/MB3845  
USAGE PRECAUTION  
1. Never use settings exceeding maximum rated conditions.  
Exceeding maximum rated conditions may cause permanent damage to the LSI.  
Also, it is recommended that recommended operating conditions be observed in normal use.  
Exceeding recommended operating conditions may adversely affect LSI reliability.  
2. Use this device within recommended operating conditions.  
Recommended operating conditions are values within which normal LSI operation is warranted.  
Standard electrical characteristics are warranted within the range of recommended operating conditions and  
within the listed conditions for each parameter.  
3. Printed circuit board ground lines should be set up with consideration for common  
impedance.  
4. Take appropriate static electricity measures.  
• Containers for semiconductor materials should have anti-static protection or be made of conductive material.  
• After mounting, printed circuit boards should be stored and shipped in conductive bags or containers.  
• Work platforms, tools, and instruments should be properly grounded.  
• Working personnel should be grounded with resistance of 250 kto 1 Mbetween body and ground.  
5. Do not apply negative voltages.  
The use of negative voltages below –0.3 V may create parasitic transistors on LSI lines, which can cause  
abnormal operation.  
6. Reverse Current Prevention Function  
Current cannot flow back to the VIN pin with the switch off, even when the OUT pin voltage is higher than the  
VIN pin (OUT VIN), however when VIN pin voltage is lower than 1.5 V circuit functions are lost, so that in this  
case there is danger of reverse current flow. For applications in which reverse flow is not acceptable, set  
VIN 1.5 V.  
ORDERING INFORMATION  
Part number  
MB3842PFV  
MB3845PFV  
MB3845PFV-ER  
Package  
Remarks  
20-pin Plastic SSOP  
(FPT-20P-M03)  
17  
 
MB3842/MB3845  
PACKAGE DIMENSION  
*: These dimensions do not include resin protrusion.  
20-pin plastic SSOP  
(FPT-20P-M03)  
1.25 +00..1200  
*
6.50±0.10(.256±.004)  
(Mounting height)  
.049 +..000048  
0.10(.004)  
INDEX  
*
4.40±0.10 6.40±0.20  
(.173±.004) (.252±.008)  
5.40(.213)  
NOM  
"A"  
0.22 +00..0150  
.009 +..000024  
0.15 +00..0025  
.006 +..000012  
Details of "A" part  
0.10±0.10(.004±.004)  
0.65±0.12  
(.0256±.0047)  
(STAND OFF)  
0
10°  
0.50±0.20  
(.020±.008)  
5.85(.230)REF  
Dimensions in mm (inches).  
C
1994 FUJITSU LIMITED F20012S-2C-4  
18  
 
MB3842/MB3845  
FUJITSU LIMITED  
All Rights Reserved.  
The contents of this document are subject to change without notice.  
Customers are advised to consult with FUJITSU sales  
representatives before ordering.  
The information and circuit diagrams in this document are  
presented as examples of semiconductor device applications, and  
are not intended to be incorporated in devices for actual use. Also,  
FUJITSU is unable to assume responsibility for infringement of  
any patent rights or other rights of third parties arising from the use  
of this information or circuit diagrams.  
The products described in this document are designed, developed  
and manufactured as contemplated for general use, including  
without limitation, ordinary industrial use, general office use,  
personal use, and household use, but are not designed, developed  
and manufactured as contemplated (1) for use accompanying fatal  
risks or dangers that, unless extremely high safety is secured, could  
have a serious effect to the public, and could lead directly to death,  
personal injury, severe physical damage or other loss (i.e., nuclear  
reaction control in nuclear facility, aircraft flight control, air traffic  
control, mass transport control, medical life support system, missile  
launch control in weapon system), or (2) for use requiring  
extremely high reliability (i.e., submersible repeater and artificial  
satellite).  
Please note that Fujitsu will not be liable against you and/or any  
third party for any claims or damages arising in connection with  
above-mentioned uses of the products.  
Any semiconductor devices have an inherent chance of failure. You  
must protect against injury, damage or loss from such failures by  
incorporating safety design measures into your facility and  
equipment such as redundancy, fire protection, and prevention of  
over-current levels and other abnormal operating conditions.  
If any products described in this document represent goods or  
technologies subject to certain restrictions on export under the  
Foreign Exchange and Foreign Trade Law of Japan, the prior  
authorization by Japanese government will be required for export  
of those products from Japan.  
F0001  
FUJITSU LIMITED Printed in Japan  
 

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